Dufu Technology Corp. Berhad (7233.KL) Dividend - Dates, Amount and Yield
Dufu Technology Corp. Berhad (7233.KL) has its next ex-dividend date on August 27, 2026, with a dividend of RM 0.02 per share.
Next dividend
- Ex-dividend date
- Payment date
- Record date
- Dividend amount
- RM 0.02
- Dividend yield
- 1.00%